burn in my lightODE 干什么的

关机时显示器不黑屏而是显示burn in mode,如何解决?_百度知道
关机时显示器不黑屏而是显示burn in mode,如何解决?
SONY LCD SDM-E76D
我也知道要改,具体怎么改?
设置显示器 改回默认模式看下显示器的说明书(直接按显示器上的按钮,不是在系统里改)
其他类似问题
黑屏的相关知识
其他3条回答
主机关闭就行了,把显示器的设置该一下。
到显示器OSD菜单里找找看吧将burn in mode:选为OFF 试试看
等待您来回答
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我的显示器开机后显示burn in
开机后显示burn in
           
是不是显示一会儿就消失了,而后工作正常呀?如果是的话是正常现象。是说显示器正在预热之中。
大家还关注FurMark: VGA Stress Test, Graphics Card and GPU Stability Test, Burn-in Test, OpenGL Benchmark and GPU Temperature | oZone3D.Net
FurMarkCurrent Version: 1.15.1GPU Caps ViewerCurrent Version: 1.23.0PhysX FluidMarkCurrent Version: 1.5.2GeeXLabCurrent Version: 0.4.0GPU SharkCurrent Version: 0.9.4TessMarkCurrent Version: 0.3.0ShaderToyMarkCurrent Version: 0.3.0BlogsGeeks3D's ArticlesDemoniak3DCurrent Version: 1.23.0LanguageLanguage:EnglishFran?ais3D Graphics Search Engine:
GPU Stress TestOpenGL Benchmark
FurMark 1.15.1 WinXP / Vista / Win7
Previous versions:
The forum for scores or bug report, is here:
What is FurMark? FurMark is a very intensive
benchmark that uses fur rendering algorithms
to measure the performance of the graphics card. Fur rendering is especially adapted to overheat the GPU and that's why FurMark is also a
perfect stability and stress test tool (also called GPU burner) for the graphics card.
FurMark requires an OpenGL 2.0 compliant graphics card: NVIDIA GeForce 6 (and higher), AMD/ATI Radeon 9600 (and higher), Intel HD Graphics
or a S3 Graphics Chrome 400 series with the latest graphics drivers.
The startup interface allows you to tweak the benchmark features such as:
Benchmark mode or stability / burn-in test mode (for overclockers)
GPU temperature monitoring and recording in a file
Fullscreen or windowed for each type of run mode
Window size selection (standard or custom)
MSAA samples selection
The interface is available in several languages (english, french, chinese, etc.). The complete list is available here:
If you want to translate the interface in another language, feel free to send the translated file
(see gui-english.xml in FurMark's folder for an example) at jegx AT ozone3d.net.
You can also validate the score online: just click on [Submit]. This action sends score data to the oZone3D.Net server
and you get in return a validation ID that allows an online checking of the score.
The scores webpage is here:
To check a score, just pass the validation ID to the furmark_score_190.php page:
Only presets (preset:1080 and preset:720) allow to submit a score online.
At the end of the benchmark, just read the number of points in the result dialog box. The point-based score is simple:
it's the number of frames that have been displayed during the benchmark.
Thus the higher the score, the more powerful the graphics system.
Command Line Parameters
FurMark 1.4.0 introduces command line parameters to control how FurMark is launched. For more information about these parameters
The following command line starts FurMark with benchmark's default parameters:
C:\{FurMark Directory}&start FurMark.exe /run_mode=1 /max_time=60000/width=1280 /height=1024 /msaa=0 /nogui /fullscreen
Burn-in and Xtrem Burn-in
The Burn-in mode is a mode where the workload of GPU is maximal. In this mode, the donut is displayed in
front side which offers the largest surface. In this mode, the :
FurMark Scores - Comparative Tables
Comparative tables of FurMark scores (Preset:1080 and Preset:720) are now available .
FurMark Related News
GLSL Hacker
Geeks3D latest news
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Page generated in 0.36 seconds.Stressing of redundant memory bits during burn-in test | EDN
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Stressing of redundant memory bits during burn-in test
-January 12, 2015
Burn-in stressing of an SoC has a few disadvantages, one of them being non-uniform stressing of logic. Here we will discuss non-uniform stressing of memory. Devices, when under burn-in stressing, can have repaired or non-repaired memories. If device has a repaired memory then only the selected redundant columns (or rows) of memory will be accessed during the burn-in stress and the un-used remaining redundant columns (or rows) will not be accessed which will leave certain portion of memory un-stressed. Similar is the case with a non-repaired memory, here all the redundant columns (or rows) are left un-stressed. This translates into inability to repair a device after burn-in and infield repair. If repair (after burn-in or infield) is attempted, it will expose an un-stressed logic, which means reliability concerns.
& Design Change A circuit which get active during Memory BIST burn-in mode and enables the access to every redundant column or row) of memory during the burn-in run. By this circuit uniform stressing of all redundant columns (or rows) is achieved. The proposed circuit has the following components: Event detector: detects the completion of selected March Algorithm run of Memory BIST during BURNIN.Repair data logic controller: Changes the data loaded into the repair data register after completion of each full Memory BIST run to ensure a uniform stress distribution.& Repair information is loaded by Memory BIST controller from the fuse or flash into the repair data register which enable the replacement of faulty column (or row) with the redundant columns (or rows) in-order to repair a device.
During the Memory BIST burn-in stressing, the BIST is set to run in an infinite loop, here the event detector detects the completion of selected MARCH Algorithm run and with each run completion its generates a trigger which goes to repair data calculator and changes the selected column (or row) as faulty and resulting in removing it from test for that run. This process repeats for each run, selecting a new column (or row) as faulty. This process results in applying a uniform stress on the memory during the process. &
Conclusion With the above proposed circuitry in place, we can ensure that during burn-in stressing of memories the entire memory array is uniformly stressed. This circuit does not require any change in in memory design or Memory BIST logic, so is easy to implement.
Additionally this is a fully automated process (achieved via hardware), which does not require any input or control from outside the device, which fits well with the burn-in tester requirements of minimum interactions during testing. Also see:
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